New Webinar! IdEM Broadband Macromodeling Tool for Electronic Device Characterization

View this email in your browser

Electronic Device Characterization using IdEM Broadband Macromodeling Tool

The data rates of modern high-speed electronics mean that these are effectively high-frequency devices. At these frequencies, electromagnetic wave effects, combined with the 3D structure and non-ideal material properties of the component, can lead to signal integrity (SI) and power integrity (PI) issues that can cause a malfunction. Using simulation during the design process can help engineers to identify potential SI or PI problems and mitigate them. However, such simulations are very challenging due to the extreme complexity of state-of-the-art high-speed applications.

The Electronics Design Analysis solution by Dassault Systèmes seamlessly combines macromodeling, circuit and 3D electromagnetic simulation within CST Studio Suite. Using this approach, electromagnetic interference, cross-talk, conducted and radiated emissions and susceptibility can be fully understood and controlled before they become a problem.

Join Dassault Systèmes’ SIMULIA Industry Process Consultant, Yun Xu, on Tuesday September 13^th to learn how this solution can improve the circuit modeling process.

Sign Up Now

Our mailing address is:
engineering.com · 5285 Solar Drive · Mississauga, Ontario L4W 5B8 · Canada

Update your preferences | Unsubscribe from this list

SIMULIA Industry Process Consultant IdEM Broadband Macromodeling Tool modern highspeed electronics expensive physical tests Electronic Device Characterization NEW Live Webinar nonideal material properties art highspeed applications CST Studio Suite electromagnetic wave effects high accuracy simulation circuit modeling process

New Webinar! IdEM Broadband Macromodeling Tool for Electronic Device Characterization

Key phrases

Older messages

Easy-to-use power integrity analysis for digital, analog, & 3D IC chip designs

New Webinar! Optimizing 3D printing processes with 4D_Additive software solutions

New White Paper! How to select the best processor & HPC system

Engineer's Picks: 3D Simulation Engineers and Electronics Designers Take Note

Engineer's Picks: 3D Printing as a Solution in Product Development

You Might Also Like

Data Science Weekly - Issue 543

A deal made in cloud security heaven

💎 Issue 413 - RubyJS-Vite

💻 Issue 406 - Swift for C++ Practitioners, Part 1

💻 Issue 413 - How to implement HLS Video Streaming in a React App

📱 Issue 407 - Textual Healing: iOS Text Editing Minutiae

💻 Issue 413 - Interview with Senior JavaScript Developer 2024 [video]

💻 Issue 331 - 30+ app ideas with complete source code

💻 Issue 408 - Curl: Hyper, is it worth it?

📱 Issue 410 - Swift for C++ Practitioners, Part 1