Webinar Next Week! Semiconductor Packaging for Faster Time to Market

engineering.com
Leveraging Advanced Semiconductor Packaging for Faster Time to Market - May 27, 2PM ET
Live Webinar - Leveraging Advanced Semiconductor Packaging for Faster Time to Market
The semiconductor device industry is undergoing a revolution driven by the demands of new and emerging markets. The simultaneous demands for increased functionality and denser designs is dramatically increasing the need for some form of advanced semiconductor packaging in most of today’s complex products.

A common theme across today’s advanced semiconductor packages is that they all present some unique challenge to traditional design tools and methodologies. During this webinar, we’ll discuss the need for an optimized, correct by construction, collaborative process during semiconductor device package design to ensure faster time to market. 

Key topics include:

  • State of the semiconductor device industry
  • Discussion of advanced packaging opportunities and challenges
  • Need for ECAD-MCAD collaboration during semiconductor package development
  • Demonstration of multi-domain design (ECAD, MCAD, and thermal analysis) for advanced semiconductor package development

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