Webinar Tomorrow! Leveraging Advanced Semiconductor Packaging

Leveraging Advanced Semiconductor Packaging for Faster Time to Market - Tomorrow, 2PM ET

The simultaneous demands for increased functionality and denser designs is dramatically increasing the need for some form of advanced semiconductor packaging in most of today’s complex products. During this webinar, we’ll discuss the need for an optimized, correct by construction, collaborative process during semiconductor device package design to ensure faster time to market.

Key topics include:

State of the semiconductor device industry
Discussion of advanced packaging opportunities and challenges
Need for ECAD-MCAD collaboration during semiconductor package development
Demonstration of multi-domain design (ECAD, MCAD, and thermal analysis) for advanced semiconductor package development

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eBook: Industrial Internet of Things & Digital Transformation

Upcoming Webinar - Electronic Component Sourcing & Covid-19 Research Results: Top Challenges & Their Impact

Supplyframe will present their findings and insights to guide transformation of current processes to drive greater agility, reduce risk, and improve product lifecycle margins. New insights drawn from the current impact of the Covid-19 pandemic on the global electronics value chain will also be shared. Following these results, Supplyframe will demonstrate a solution available today to empower new product introduction and strategic sourcing teams to address these key challenges.

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