Webinar Tomorrow! Leveraging Advanced Semiconductor Packaging

engineering.com
Leveraging Advanced Semiconductor Packaging for Faster Time to Market - Tomorrow, 2PM ET
The simultaneous demands for increased functionality and denser designs is dramatically increasing the need for some form of advanced semiconductor packaging in most of today’s complex products. During this webinar, we’ll discuss the need for an optimized, correct by construction, collaborative process during semiconductor device package design to ensure faster time to market. 

Key topics include:
  • State of the semiconductor device industry
  • Discussion of advanced packaging opportunities and challenges
  • Need for ECAD-MCAD collaboration during semiconductor package development
  • Demonstration of multi-domain design (ECAD, MCAD, and thermal analysis) for advanced semiconductor package development
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eBook: Industrial Internet of Things & Digital Transformation
Supplyframe will present their findings and insights to guide transformation of current processes to drive greater agility, reduce risk, and improve product lifecycle margins. New insights drawn from the current impact of the Covid-19 pandemic on the global electronics value chain will also be shared. Following these results, Supplyframe will demonstrate a solution available today to empower new product introduction and strategic sourcing teams to address these key challenges.

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