Advanced Manufacturing: The Future of Faster, Better, Cheaper

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Advanced Manufacturing Weekly Update

Manufacturing the Future: A More Accurate, Precise Future for Manufacturing

Alexander Zoller talks tooling and the future of manufacturing.

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Tesla's Large-Scale High-Pressure Die Casting

Tesla's Germany-based Gigafactory using a very large press made by the IDRA group in Italy

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Airbus Unveils Stunning New Zero-Emission Concepts

Plane maker intends to bring hydrogen-fueled passenger jets to market by 2035.

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Ethernet or Wireless on the Shop Floor? It’s Like Big Mac versus Whopper

For modern production equipment in almost every industry, if it isn’t connected, it isn’t efficient.

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OSHA in the Covid Pandemic World

What does safety mean during the pandemic in industrial operations?

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Additive Thinking Goes Big

Large format additive manufacturing is perfect for the COVID-19 “new normal.”

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Electric Cars Are on the Move, but Has the World Gone Mad?

Tesla leads auto manufacturing by market cap beating production leaders Toyota and VW.

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Fusion 360 Continues Its Push to Be Software Hub from Design to Manufacturing

Notes from Autodesk’s Advanced Manufacturing Summit

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Recommended Resources

White Paper - The Other Side of Design for Assembly

Assembly level constraints need to be satisfied before the design can move downstream. This white paper will go through the various assembly level issues, which need to be tackled by various organizations on a regular basis. Know more about DFMPro, a design for assembly software.

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Live Webinar - Dealing with Manufacturing-Skill Gaps - Oct 22, 2PM ET

Knowledge capture and reuse will be key as many mechanical industries are poised to (or already have) slashed workforces. The webinar will showcase HCL’s DFX platform using Knowledge Based Rules to relieve downstream bottlenecks.

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White Paper - Driving the Future of Advanced Automotive Batteries

This white paper describes the computer-aided engineering for batteries (CAEBAT) development project that targeted the automotive and lithium-ion battery industries with the goal of driving down development time, and enabling large market penetration of advanced EDV power systems.

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White Paper - Fabless Challenges of Integrating Complex Silicon into the IC Package, Even the System PCB

As the world demands higher performance, higher bandwidth, and greater capacity from smaller, lighter, and lower-power products, high-density advanced packaging (HDAP) becomes a design necessity. Learn what's required to build a true, multi-substrate flow for emerging HDAP design requirements.

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